STA Sialon silicon nitride extrusion dies provide performance cost advantages to the non-ferrous foundry industry. Recently, we introduced a new line of sialons (a superior class of ceramics compared to silicon nitride) advanced ceramic extrusion and drawing dies.
At the same time, we introduce our new ultrasonic extrusion die technology. The combination of this new sialon silicon nitride ceramic die and the ultrasonic technology will result in a up to 70% FASTER production compared to non-ultrasonic treatment.
Silicon Nitride ceramic extrusion dies are used for the extrusion and drawing of non-ferrous alloys in the metal extrusion industry.
With regards to Sialon ceramics, there is substitution of silicon by aluminum with corresponding atomic replacement of nitrogen by oxygen, to satisfy valency requirements. The resulting 'solution' has superior properties to the original pure solvent, syalon, silicon nitride or Si3N4.
Silicon Nitride like ceramics have found extensive use in non-ferrous molten metal handling, particularly aluminum and its alloys, including metal feed tubes for aluminum die casting, burner and immersion heater tubes, injector and degassing for nonferrous metals, thermocouple protection tubes, crucibles and ladles.
Sialon extrusion dies + ultrasound.
Elimination of pick-up.
Reduction of scrap tube production.
Improved quality of surface finish.
Increased productivity up to 70% using ultrasound.
Extrusion and drawing of (non) ferrous alloys.
Silicon nitride ceramic material with high thermal stability ,antioxidant ability,and product size excellent performance. Reaction bonded silicon nitride is made by direct nitridation of a compacted silicon powder, and because of the difficulty of ensuring complete reaction; it is hard to achieve a high component density. Usual densities are in the range 2.3 – 2.5g/cm3 compared with 3.29g/cm3 for gas pressured sintered silicon nitride. The higher density gives the HPSN, SSN & GPS-SSN materials better physical properties and means they are used in more demanding applications at very high temperature, especially for non-ferrous molten metal handling and thermocouple sheaths. The nitridation produces only a small volume change, which means that RBSN components do not need to be machined after fabrication and complex near net shapes can be produced in a single process stage.Key PropertiesApplications exploit the following properties of silicon nitridelow densityhigh temperature strengthsuperior thermal shock resistanceexcellent wear resistancegood fracture toughnessmechanical fatigue and creep resistanceExcellent non-wetting property with good oxidation resistance
SSN GPS-SSN HPSN RBSN
3.28 3.30 3.23 2.5
Young’s Modulus (GPa)
285 320 315 189
Bend Strength (MPa)
675 750 850 440
Fracture Toughness K1c (MPa.m0.5)
6 7 8 2.5
16 16 16 7.2
Thermal Expansion Coefficient (x 10-6/°C)
3.2 3.2 3.2 3.2
Thermal Conductivity (W/m.K)
25 30 30 14
Maximum Temperature (°C) for applicationDielectric ConstantAbrasive Wear resistance Parameter
1150 1150 1150 11009 9 9 7.51110 1130 1120 360
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